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G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive SEMI D22-0818 (Reapproved 0924)
G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive SEMI D22-0818 (Reapproved 0924)
$115.50
Description
SEMI D22-0818 (Reapproved 0924)
timeliness
1 These test methods are both in use within the industry
This Standard stipulates materials relating to transport of 300 mm wafers using shipping boxes (FOSB) regulated by SEMI M31
G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive SEMI D22-0818 (Reapproved 0924)global Assembly & Packaging Technical Committee2012221global Audits and Reviews Subcommittee20124www. semiviews. org www. semi. org BGA Referenced SEMI Standards None.
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