F04700 - SEMI F47 - Specification for Semiconductor Processing Equipment Voltage Sag Immunity StdTpc-Flat Panel Display 1 mm厚のガラス基板の水平搬送や保管に使用するカセットについて規定する。

1 mm厚のガラス基板の水平搬送や保管に使用するカセットについて規定する。

• Carrier transfers to/from production equipment internal buffer space

Examples of the other films except polarizing films are retardation films

and development work

F04700 - SEMI F47 - Specification for Semiconductor Processing Equipment Voltage Sag Immunity StdTpc-Flat Panel Display 1 mm厚のガラス基板の水平搬送や保管に使用するカセットについて規定する。Semiconductor factories require high levels of power quality due to the sensitivity of equipment and process controls. Semiconductor processing equipment is especially vulnerable to voltage sags. This Specification defines the voltage sag immunity required for semiconductor processing, metrology, and automated test equipment. This Specification strikes a balance between voltage sag immunity and increased equipment cost. This Specification sets minimum