M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness StdPbc-0912 In addition to the interviews

In addition to the interviews

The Guide focuses on analysis of HPIX resin used in UPW

SEMI E4 — Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)

Referenced SEMI Standards (purchase separately)

M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness StdPbc-0912 In addition to the interviewsWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer to determine if the dimensional characteristics of a wafer satisfy given geometrical requirements. This Test Method is suitable quantifying the near edge geometry of wafers used in semiconductor device processing. The PSFQR or PSFQD metric is suitable for quantifying near edge