MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded and cost-effectiveness as key elements

and cost-effectiveness as key elements of successfully installing semiconductor processing equipment into wafer fabrication facilities

It should be noted that the following list of criteria was considered when determining the specified analytical method

The formats for data produced as a result of executing a data collection plan are also defined

orgで入手可能になり，2004年11月発行に至る。初版は1990年。

MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded and cost-effectiveness as key elements1 Purpose 1. 1 This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together. 2 Scope 2. 1 This Guide applies to targets that can be used with two common alignment processesinner surface alignment and outer surface alignment. 2. 2 This Guide