A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Revision:SEMI A2-1019 - Superseded the issue is control of

the issue is control of film thickness variation introduced by nanotopography

1e12-1e13 C atoms/cm2

The purpose of this Document is to define the test method used to characterize the susceptibility of semiconductor processing

This Document defines three orthogonal reference planes as references for carrier dimensions

A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Revision:SEMI A2-1019 - Superseded the issue is control ofThe purpose of this Standard is to provide a standardized automation interface specification to be used for the equipment control in an assembly line for printed circuit board (PCB) that uses surface mount technology (SMT). The purpose of this Standard is to provide an interface specification that replaces conventional electrical interface with a network connection and adds data communication capability. The scope of this Standard is to define an