G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes StdTpc-Equipment Models This Specification is intended to

This Specification is intended to be used with the polished wafer specification (SEMI M1) and the epitaxial wafer specification (SEMI M2)

金属発生限度

independent of thickness variation and surface finish

referencing the feature sizes contained in the International Roadmap for Devices and SystemsTM (IRDSTM)

G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes StdTpc-Equipment Models This Specification is intended toNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard specifies the requirements for plating layers on leadframes intended for use at the upcoming inspection. The specifications and test procedures detailed in this Standard apply to the internal section of