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G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 SEMI E40-0200 (technical revision)
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 SEMI E40-0200 (technical revision)
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Description
SEMI E40-0200 (technical revision)
1-0312 (technical revision)
and behavior identified in these Standards
SEMI E119 — Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300 mm Wafers
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 SEMI E40-0200 (technical revision)This Standard defines the pull strength test method for wire bonding. Referenced SEMI Standards None.
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