P00300 - SEMI P3 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates Revision:SEMI P3-0308 - Inactive This Test Method applies only

This Test Method applies only for 3-point bending method

orgで，そして2008年3月にCD-ROMで入手可能となる。初版は2003年7月発行，前版は2007年11月に発行された。

would report the same data

provides an indication of the native nucleation sites present in the as-received wafers

P00300 - SEMI P3 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates Revision:SEMI P3-0308 - Inactive This Test Method applies onlyNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. NOTICE: This Document was completely rewritten in 2008. This Specification covers the general requirements on the photoresist and e beam resist coating for hard surface photoplates. See SEMI P1 and SEMI P2 for requirements