G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Revision:Default Title This Guide should be used

This Guide should be used in conjunction with SEMI F63 and SEMI F75

exposure field

cleaved wafers can be accepted as long as it does not cause a significant drop in the sensitivity (from a quarter to a half of a wafer)

The lower detection limit when the molecular weight is assumed as 300 and carbon numbers as from 10 to 20 is in the range of 5e10–5e11 molecules/cm2

G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Revision:Default Title This Guide should be usedglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org19801997 : DIP Referenced SEMI Standards SEMI G10 Standard Method for Mechanical Measurement of Plastic Package Leadframes SEMI G18 Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes