3D02000 - SEMI 3D20 - Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications StdTpc-Documentation/Training • Description of the specification

• Description of the specification conventions used

EPT enables factory engineers to evaluate the time that equipment and modules spent in different states and identify areas for improvement

本試験方法は，一辺の長さが125ｍｍ以上で，厚さが100μm 以上の正方形および擬似正方形の太陽電池シリコンセルを対象とする。

SEMI E82-1105 (technical revision)

3D02000 - SEMI 3D20 - Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications StdTpc-Documentation/Training • Description of the specificationPanel level packaging (PLP) is projected to become a critical packaging process. This Specification identifies the physical properties that must be specified for the semiconductor industry to produce an equipment set for successful implementation of PLP. Many of the applications for panel packaging lines include fan out technology applications. To permit common processing equipment, standardized panel (largest external) dimensions (whether with or