F04900 - SEMI F49 - Guide for Semiconductor Factory Systems Voltage Sag Immunity Revision:SEMI F49-0200 (Reapproved 1108) - Superseded stacked chip on substrate (SCoS)

stacked chip on substrate (SCoS)

The assumption of wafer-to-wafer (W2W)

The first purpose of this Specification and Guide is to standardize requirements for Grades of hydrogen peroxide used in the semiconductor industry and to document testing procedures that may be used to support those requirements

SEMI G86-0303 (first published)

F04900 - SEMI F49 - Guide for Semiconductor Factory Systems Voltage Sag Immunity Revision:SEMI F49-0200 (Reapproved 1108) - Superseded stacked chip on substrate (SCoS)A guide defining a systems approach to power conditioning is needed for semiconductor and flat panel display (FPD) facilities. Semiconductor and FPD factories require high levels of power quality due to the sensitivity of equipment and process controls. Semiconductor and FPD processing equipment are especially vulnerable to voltage sags. The facility electrical system distributes power to process equipment, support equipment, and facility