M04300 - SEMI M43 - Guide for Reporting Wafer Nanotopography Revision:SEMI M43-0418 (Reapproved 0923) - Current 1 Some terms are specialized

1  Some terms are specialized to a semiconductor manufacturing environment

SEMI E116-0706 (technical revision)

the concern is simply with controlling the process so that such impurities are not present

The purpose of this Standard is to introduce Wafer Job (WJ) in order to observe and/or control a wafer (and its information including context information from related actions such as pre-processing

M04300 - SEMI M43 - Guide for Reporting Wafer Nanotopography Revision:SEMI M43-0418 (Reapproved 0923) - Current 1 Some terms are specializedThis Guide provides a framework for reporting of nanotopography surface features on silicon wafers. This Guide addresses reporting the characterization of nanotopography surface features found on wafer surfaces. Nanotopography is the non planar deviation of the whole front wafer surface within a spatial wavelength range of approximately 0. 2 to 20 mm and within the fixed quality area (FQA). Typical examples include dips, bumps or waves on the wafer