E08300 - SEMI E83 - PGVメカニカルドッキングフランジの仕様 Revision:SEMI E83-0413 - Superseded oxygen plasma may be used

oxygen plasma may be used separately or in conjunction with these techniques

SEMI P38 — Specification for Absorbing Film Stacks and Multilayers on Extreme Ultraviolet Mask Blanks

and the mixture 70wt% PGME/30wt% PGMEA which are used as solvents in the semiconductor industry for advanced resist technology

SEMI E16-90 (Reapproved 0699)

E08300 - SEMI E83 - PGVメカニカルドッキングフランジの仕様 Revision:SEMI E83-0413 - Superseded oxygen plasma may be usedSEMI SEMI Physical Interfaces & Carriers Global Technical Committee2014512global Audits and Reviews Subcommittee20147www. semiviews. org www. semi. org1999620134 PGV PGVSEMI E15. 1SEMI G82 300mmSEMI 154 450mmSEMI E64 Referenced SEMI Standards SEMI E15 Specification for Tool Load Port SEMI E15. 1 Specification for 300 mm Tool Load Port SEMI E64 Specification for 300 mm Cart to SEMI E15. 1 Docking Interface Port SEMI E154 Mechanical Interface