Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X / XS / XS Max Tag-Auxiliary Clamp Clip It supports mainstream model number

It supports mainstream model number more than 500pcs

which can easily turn the screws in the narrow spaces and corners

One Package Size 17cm * 9

it can be used for resin adhesive/UV adhesive/optical adhesive/photosensitive green oil/shadowless adhesive/ink curing

Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X / XS / XS Max Tag-Auxiliary Clamp Clip It supports mainstream model number1. Strong magnetic adsorption, simple operation 2. Fast and convenient soldering 3. High temperature resistance and easy heat dissipation 4. Pewter can be planted accurately at mesh position 5. No damage to the motherboard, accurate positionin Specification: Package Weight One Package Weight 0. 11kgs 0. 25lb One Package Size 15cm * 11cm * 3cm 5. 91inch * 4. 33inch * 1. 18inch Qty per Carton 80 Carton Weight 10. 60kgs 23. 37lb Carton Size 46cm * 32cm *