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Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections included-in-kit but with total net heat

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but with total net heat inputs in excess of 70 kW are also covered by this standard

The cold tests are subdivided as follows:

The Big Picture aims at monitoring the consistency of published standards and current or future standardization projects

provided a comprehensive scheme of certification exists and the method or technique is covered by International

Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections included-in-kit but with total net heat

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