E19300 - SEMI E193 - Specification for 300 mm Film Frame FOUP (FFF) volume-C Many requirements given in this

Many requirements given in this Specification are in the form of maximum or minimum dimensions with very few required surfaces

This Test Method describes procedures for characterizing silicon wafers to determine gate oxide integrity (GOI)

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maintenance technicians and engineers

E19300 - SEMI E193 - Specification for 300 mm Film Frame FOUP (FFF) volume-C Many requirements given in thisNOTICE: This Standard does not follow normal formatting rules; it is being published with colored text in Table 1, 10. 4. 1, 10. 4. 1. 2, 10. 4. 1. 3, and Table 2. 1 Purpose 1. 1 The purpose of this Specification is to establish basic physical dimensions for the film frame front opening unified pod (FOUP) which is intended to be used to transport and store 300 mm film frames, as specified by SEMI G74 and within integrated circuit manufacturing