Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working img{max-width:100%} SVG Silicon Valley Group

img{max-width:100%}  SVG Silicon Valley Group 851-8220-011 Processor PCB Card Rev

Eprom 1: IDAC2 Log

Inventory # G7802

5010-203089-11 FLANGE (Qty

Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working img{max-width:100%} SVG Silicon Valley GroupRudolph Technologies AT SM Die Prep Kit F30 300mm Wafer Defect System Working Inventory # A 19531 Model No: AT SM Die Prep Kit Removed from a Rudolph Technologies F30 300mm Wafer Mounter & Defect Inspection System Included Components Part No: 734202, Rev. A Part No: F30 Chuck O Ring Part No: Retaining Nut NSK Part No: HGP NZ1 NKS Part No: AFE CA, X Y AXIS NKS Part No: LG2, Z AXIS This Rudolph Technologies AT SM Die Prep Kit is used working surplus.