+ 0. 5 on surface, <010> + 1on edge Polish: One side EPI polished by CMP technology with minimum sub surface damage. Surface finish (RMS or Ra) : < 10A (By AFM 5x5 um2Normal0MicrosoftInternetExplorer4 ) Normal0MicrosoftInternetExplorer4 Packing: The substrate is packed with 100 grade clean plastic bag under 1000 class clean room. Precautions:">
+ 0. 5 on surface, <010> + 1on edge Polish: One side EPI polished by CMP technology with minimum sub surface damage. Surface finish (RMS or Ra) : < 10A (By AFM 5x5 um2Normal0MicrosoftInternetExplorer4 ) Normal0MicrosoftInternetExplorer4 Packing: The substrate is packed with 100 grade clean plastic bag under 1000 class clean room. Precautions:">
+ 0. 5 on surface, <010> + 1on edge Polish: One side EPI polished by CMP technology with minimum sub surface damage. Surface finish (RMS or Ra) : < 10A (By AFM 5x5 um2Normal0MicrosoftInternetExplorer4 ) Normal0MicrosoftInternetExplorer4 Packing: The substrate is packed with 100 grade clean plastic bag under 1000 class clean room. Precautions:">
MgO (100) Substrate 10 x 10 x 0.2 mm, 1SP - MGa101002S1 Orientation 210 Wafer Size: 2" dia x – salirdelamultipropiedad.es
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MgO (100) Substrate 10 x 10 x 0.2 mm, 1SP - MGa101002S1 Orientation 210 Wafer Size: 2" dia xSpecifications: Size: 10mm x 10mm x 0. 2mm + 0. 05 mm (choose 1. 0 mm thick at extra cost) Orientation: <100> + 0. 5 on surface, <010> + 1on edge Polish: One side EPI polished by CMP technology with minimum sub surface damage. Surface finish (RMS or Ra) : < 10A (By AFM 5x5 um2Normal0MicrosoftInternetExplorer4 ) Normal0MicrosoftInternetExplorer4 Packing: The substrate is packed with 100 grade clean plastic bag under 1000 class clean room. Precautions:
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