Al2O3 - Sapphire Wafer 2" x0.5 mm, A plane (11-20), 2 SP - ALA50D05C2 Thin-Film/Flexible Battery Optional The 4" sintered diamond
$106.38
Description
Optional The 4" sintered diamond blade is the replacement for SYJ-150 Low Speed Cutting Saw
no thicken agent required 2
3mm Width Nickel Tab as Negative Terminal for Welding on Cylindrical Cell Electrode
180-200C for upper blade
Al2O3 - Sapphire Wafer 2" x0.5 mm, A plane (11-20), 2 SP - ALA50D05C2 Thin-Film/Flexible Battery Optional The 4" sintered diamondFeatures: A plane (11 20) sapphire wafer is being used extensively as a substrate for III V nitrides and magnetic epitaxial films due to its better lattice mismatch Wafer size: 2" dia x 0. 5 mm thickness Orientaion: A plane <11 20> ori.( + 05o) with Standard Flat Polished surface: Wafer surface is EPI polished via a special CMP procedure on both sides with average roughness Ra < 0. 5 nm RMS Package: Each wafer is packed in 1000 class clean room with
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.