Soft soldering fluxes. Test methods - Solubility of flux residues Ingestion-build-181247 Providing details of the context

Providing details of the context of EFC applications

It determines requirements and tests enabling the interchangeability of Buchholz relays by defining the following types of interfaces:

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– radiation pulse duration

Soft soldering fluxes. Test methods - Solubility of flux residues Ingestion-build-181247 Providing details of the context1 Scope This document specifies a qualitative method for assessing the solubility of flux residues in a selected solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 94541. NOTE This test gives no assurance that post cleaning residues, which may be present in sufficiently small amounts to pass the test, will not be detrimental to the soldered assembly in the long term.