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Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods not-for-sale BS CECC 123500-003 is an
Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods not-for-sale BS CECC 123500-003 is an
$136.00
Description
BS CECC 123500-003 is an international standard used for Harmonized system of quality assessment for electronic components that specifies the test method and test procedure for Flexible printed boards
5 Requirements for colour
It has been completely revised
The sheet specifies the data necessary for material acquisition
Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods not-for-sale BS CECC 123500-003 is an
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