BEARING 6310 (WEST) Item Number:52292387
US$ 190.27
Fused Silica Wafer, 4" x 0.5 mm, 2 side polished Br Diamond Grinding Plate (1800 mesh)
$137.43
Description
Diamond Grinding Plate (1800 mesh) 1 pc EQ-PP-8FPB-SY 8" Polyamide Foam polishing Pad 2 pcs EQ-MW025 Diamond Compound Polishing Paste (0
At the mean while
For the properties of BK7
Capacity 158 mAh / g
Fused Silica Wafer, 4" x 0.5 mm, 2 side polished Br Diamond Grinding Plate (1800 mesh)Fused Silica Wafer Size: 4"diameter x 0. 5 mm Polishing: two sides polished Surface Roughness: < 5 A Related products: Other Fused Silica Substrates: BK7 Glass FTO Glass ITO Coated Glass
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
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