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Bambu Lab AP Board Cover - H2D bondtech BMG extruder - 2 mm hex key

$19.99

Quantity
Description

- 2 mm hex key

Brushless Motor

-Cable Base *1

The Bambu Lab Liquid Glue can be cleaned easily from the print surface and from models

Bambu Lab AP Board Cover - H2D bondtech BMG extruder - 2 mm hex keyOverview Covers and protects the AP board from dust and damage. Installation Learn more about AP Board Cover on Bambu Lab Wiki. In the Box AP Board Cover*1 Cable Tray Cover*1 BT2. 6 8 Screw*1 Compatibility H2D and H2D Laser Product Specifications Materials Plastic Packaging Size 122*122*262 mm Color Black Packaging Weight 0. 186 kg

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