Semiconductor devices. Micro-electromechanical devices - Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures Ingestion-build-84997 track circuit signalling systems

track circuit signalling systems

Electrical safety of appliances and immunity to electromagnetic phenomena

related to

discovery and integration

Semiconductor devices. Micro-electromechanical devices - Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures Ingestion-build-84997 track circuit signalling systems1 Scope This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 m to 1 000 m in the plane direction and from 1 m to 100 m in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 m and 10 m in thickness.