Semiconductor devices. Micro-electromechanical devices - Bend testing methods of thin film materials Ingestion-build-264231 Contents of technical file

Contents of technical file

This Part 603 of IEC 60811 gives the test methods to examine the filling compound for corrosive elements

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Manufacturers of equipment and components of liquid cooling systems

Semiconductor devices. Micro-electromechanical devices - Bend testing methods of thin film materials Ingestion-build-264231 Contents of technical file1 Scope This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 m and 10 m. Thin films are used as main structural materials for Micro electromechanical Systems (abbreviated as MEMS in this document) and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material