Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect Ingestion-build-52208 3 DEFINITIONS

3 DEFINITIONS

a) electrical test and measurement equipment which by electrical means tests

and requirements on joints

The scope of BS ISO IEC 29794 does not cover:

Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect Ingestion-build-52208 3 DEFINITIONSWhat is this standard about? This part of IEC 63011 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die to die alignment is used in the die stacking.