Semiconductor devices. Mechanical and climatic test methods - Board level drop test method using a strain gauge Ingestion-build-105964 equivalent bending stiffness

equivalent bending stiffness

BS EN 485-2 exemplifies the required mechanical properties that help you achieve precision in terms of product functionality and specification

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Semiconductor devices. Mechanical and climatic test methods - Board level drop test method using a strain gauge Ingestion-build-105964 equivalent bending stiffness1 Scope This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the