ori. sapphire wafer is being used extensively as a substrate for III V nitrides and magnetic epitaxial films due to its better lattice mismatch Wafer size: 2" dia x 0. 5 mm thickness Orientaion: M plane <10 10>orn + 0. 5 Deg Polished surface: Wafer surface is EPI polished via a special CMP procedure. Price listed here is for one side polished Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with"> ori. sapphire wafer is being used extensively as a substrate for III V nitrides and magnetic epitaxial films due to its better lattice mismatch Wafer size: 2" dia x 0. 5 mm thickness Orientaion: M plane <10 10>orn + 0. 5 Deg Polished surface: Wafer surface is EPI polished via a special CMP procedure. Price listed here is for one side polished Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with"> ori. sapphire wafer is being used extensively as a substrate for III V nitrides and magnetic epitaxial films due to its better lattice mismatch Wafer size: 2" dia x 0. 5 mm thickness Orientaion: M plane <10 10>orn + 0. 5 Deg Polished surface: Wafer surface is EPI polished via a special CMP procedure. Price listed here is for one side polished Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with"> Al2O3- Sapphire Wafer, M Plane, 2"Dia x0.5mm, 2SP - ALM50D05C2 Orientation 100 Features High precision cutting for – salirdelamultipropiedad.es

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Al2O3- Sapphire Wafer, M Plane, 2"Dia x0.5mm, 2SP - ALM50D05C2 Orientation 100 Features High precision cutting for

$112.12

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Features High precision cutting for hard and brittle nonmetal materials such as Si

Temperature range: -40° C to +90° C

M plane orientation

the glove box can be vacuumed by a mechanical pump up to 0

Al2O3- Sapphire Wafer, M Plane, 2"Dia x0.5mm, 2SP - ALM50D05C2 Orientation 100 Features High precision cutting forFeatures: M <10 10> ori. sapphire wafer is being used extensively as a substrate for III V nitrides and magnetic epitaxial films due to its better lattice mismatch Wafer size: 2" dia x 0. 5 mm thickness Orientaion: M plane <10 10>orn + 0. 5 Deg Polished surface: Wafer surface is EPI polished via a special CMP procedure. Price listed here is for one side polished Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with

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