G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded SEMI D34-0710 (technical revision)

SEMI D34-0710 (technical revision)

This Standard describes a Guide for analysis of virgin high-purity ion exchange (HPIX) resin suitable for use in ultrapure water (UPW) polish applications

This Guide addresses universal alignment mark

Capacity tests are done by adding ppm levels of a given gaseous impurity to a pure zero gas and monitoring the effluent of the test purifier for active impurity species

G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded SEMI D34-0710 (technical revision)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard describes procedures for measuring the mechanical, physical, chemical, thermal, and electrical properties of leadframe tape. Equipment, sampling, and procedures are referred to in the individual test methods.